▎ 摘　　要

NOVELTY - High heat conducting complex gel comprises a gel base material, a heat conducting filler, and a coupling agent formed under the action of a catalyst. The heat conducting filler comprises graphitized diamond particles and heat conducting auxiliary materials. The surface of the graphitized diamond particles is grown with layered graphene. The heat conducting auxiliary material comprises aluminum oxide, zinc oxide, beryllium oxide and/or hexagonal boron nitride. The mass ratio of the gel base material to the heat conducting filler is 1:9.5-15.2. The mass ratio of the heat conducting filler to the coupling agent is 125-200:1. The mass ratio of the graphitized diamond particles and the heat conducting auxiliary material in the thermally conductive filler is 4-5:1. USE - Used as high heat conducting complex gel. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the high heat conducting complex gel, comprising (i) mixing 1000-2000 pts. wt. heat conducting filler consisting of graphitized diamond particles and heat conducting filler auxiliary materials dried in a vacuum environment with 5-10 pts. wt. coupling agent and grinding to obtain a mixed filler, and (ii) mixing the 1000-2000 pts. wt. mixed filler with 50-80 pts. wt. hydroxy silicone oil, 15-40 pts. wt. trimethoxysilane, 0.5-2 pts. wt. coupling agent and 0.5-2 pts. wt. catalyst, vacuumizing, and continuously stirring at high speed.