• 专利标题:   Linker of bioprobes for immobilizing bioprobe on chip substrate of sensor, comprises amino thiol compound, thiol-carboxylic acid compound, dithiol compound, hydroxy carboxylic acid compound or hydroxy amine compound.
  • 专利号:   US2021011012-A1, TW702399-B1, TW202102851-A, EP4012409-A1, JP2022099742-A
  • 发明人:   LI C, CHEN Y, LI J W, CHEN Y C
  • 专利权人:   PHOENIX SILICON INT CORP, PHOENIX SILICON INT CORP, PHOENIX SILICON INT CORP
  • 国际专利分类:   C07C215/24, C07C321/18, C07C323/27, C07C323/54, C07C059/42, G01N033/531, G01N033/543, C12N015/40
  • 专利详细信息:   US2021011012-A1 14 Jan 2021 G01N-033/543 202109 Pages: 12 English
  • 申请详细信息:   US2021011012-A1 US925352 10 Jul 2020
  • 优先权号:   TW124590, EP212724, JP213714

▎ 摘  要

NOVELTY - Linker of bioprobes comprises amino thiol compound, thiol-carboxylic acid compound, dithiol compound, hydroxy carboxylic acid compound or hydroxy amine compound having a carbon number of 6 or more, where when an average surface roughness (Ra) of the chip substrate is greater than 250 nm, and a coverage of the linker on the chip substrate is 40-80%. USE - The linker of bioprobes is used for immobilizing bioprobe on chip substrate of sensor. The bioprobes comprise bioprobes of enzymes, proteins, deoxyribonucleic acid (DNA), ribonucleic acid (RNA) or odontoglossum ringspot virus antibodies (ORSV antibodies) (claimed). ADVANTAGE - The linker realizes optimal carbon chain length and the coverage for substrates of various roughness, and enhances the grasping ability of an electrochemical sensor chip for a detected object. DETAILED DESCRIPTION - Linker of bioprobes comprises amino thiol compound of formula: SH-(CH)n-NH2, thiol-carboxylic acid compound of formula: SH-(CH)n-COOH, dithiol compound of formula: SH-(CH)n-SH, hydroxy carboxylic acid compound of formula: (OH)m-(CH)n-COOH or hydroxy amine compound of formula: (OH)m-(CH)n-NH2 having a carbon number of 6 or more, where when an average surface roughness (Ra) of the chip substrate is greater than 250 nm, and a coverage of the linker on the chip substrate is 40-80%. m, n = greater than 1.