• 专利标题:   Electrochemical polishing solution useful for pre-treatment of copper foil surface, comprises phosphoric acid, sulfuric acid or/and hydrochloric acid, viscosity regulator and de-ionized water.
  • 专利号:   CN112921389-A, CN112921389-B
  • 发明人:   YU Y, SUN F, FENG A, CHEN B, MI L, SONG L
  • 专利权人:   SHANGHAI INST CERAMICS CHINESE ACAD SCI
  • 国际专利分类:   C23C016/02, C23G001/10, C25F003/22
  • 专利详细信息:   CN112921389-A 08 Jun 2021 C25F-003/22 202160 Pages: 17 Chinese
  • 申请详细信息:   CN112921389-A CN11244367 06 Dec 2019
  • 优先权号:   CN11244367

▎ 摘  要

NOVELTY - Electrochemical polishing solution comprises 50-200 pts. wt. phosphoric acid, 22-48 pts. wt. sulfuric acid or/and hydrochloric acid, 10-20 pts. wt. viscosity regulator and 20-30 pts. wt. deionized water. USE - The electrochemical polishing liquid is useful for pre-treatment of copper foil surface. ADVANTAGE - The electrochemical polishing liquid enables to pre-treat surface of copper foil in an efficient manner. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) pre-treatment of copper foil surface using pickling liquid comprising 3-5 pts. wt. nitric acid, 4-8 pts. wt. hydrochloric acid, 1 pts. wt. polyethylene glycol and 1-10 pts. wt. deionized water; (2) copper foil, prepared by pre-treatment of copper foil surface; and (3) use of copper foil in chemical vapor deposition (CVD)growth of graphene materials.