▎ 摘　　要

NOVELTY - This utility model provides a sealing structure of copper column convex point and packaging structure, the packaging structure comprising the metal solder plate, in device manufacture of the insulation layer, it is to prepare column bump is set with location hole way, redox graphene, forming on said metal wiring layer surface, column, wherein the redox graphene layer formation surface, metal barrier layer, forming on the copper column surface, solder bumps, forming on said metal barrier layer surface. This new utility model by using electroplating process on metal solder plate surface manufacturing graphene, replaced the traditional process of the ball lower metal layer, then using electroplating manufacturing copper column and solder metal, saving of using traditional sputtering process and lithography-etching technique manufacturing copper column and step, greatly save of process cost. This new utility model is plating copper column of high quality come up in redox graphite. Can, this utility new type can increase the device performance, has wide application prospect in the semiconductor manufacturing area.