▎ 摘　　要

NOVELTY - Preparation method of the basic copper phosphate involves: mixing basic copper carbonate and phosphoric acid for reaction at less than 70 ℃, heating to a boiling point, and then separating a liquid phase to obtain the basic copper phosphate, where the bulk density of the basic copper carbonate is 100-800 g/L. USE - Preparation method of the basic copper phosphate for use in laser etching material for in laser etching or laser activation (claimed). ADVANTAGE - The average grain diameter of the basic copper phosphate is less than 10 μm, when the adhesive is used as a laser sensitive component and applied to the field of laser forming, the adhesive has better adhesive property under the condition of equivalent viscous component when being combined with a resin matrix, and effectively prevents the metal coating from falling off, curling or hardening in the laser activation process. Meanwhile, the laser etching material has high surface finish, high fluidity and high thin-wall toughness, and has good application prospect. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a laser etching material, which comprises 10-30 pts. wt. basic copper phosphate, 50-110 pts. wt. a resin matrix, 0-30 pts. wt. a filler and 0-10 pts. wt. an auxiliary agent, where the resin matrix comprises polyethylene, polypropylene, polycarbonate, polyurethane, petroleum resin, polybutylene terephthalate, polyamide, or acrylonitrile-butadiene-styrene copolymer; and (2) copper hydroxide phosphate.