▎ 摘　　要

NOVELTY - The structure has a bonding layer used for connecting a LED chip layer and a driving substrate layer. Multiple layers stacked on a substrate LED of a core layer. The bonding layer is used for connecting a multi-layer chip. The bonding layer is composed of organic medium, multiple groups of metal wall structure and multiple metal electrodes. The organic medium realizes bonding connection between the chip layer and the driving substrate layer. A chip electrode is electrically connected with the metal electrodes. The metal electrodes are electrically connected with a metal wall that is electrically connected with the multi-layer chip. USE - High-density micro-LED array structure for a display device. Uses included but are not limited to augmented reality (AR), virtual reality (VR), smart-phone/watch, high-end TV, vehicle/vehicle display, flexible display and transparent display fields. ADVANTAGE - The metal wall can inhibit light crosstalk, and shape the emergent light shape. The structure bonding connection is reliable, the electrical connection is good, chip preparation process can realize micro-nano-grade high precision alignment. The physical bonding connection and electrical connection can reduce the requirement of the traditional metal bump bonding to the bump uniformity, integrity and structure stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a high-density Micro-LED array structure preparation method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a high-density micro-LED array structure. (Drawing includes non-English language text).