▎ 摘　　要

NOVELTY - High thermal conductivity and low thermal resistance thermal paste comprises 45-55 pts. wt. silicon substrate, 10-15 pts. wt. graphene, 3-6 pts. wt. spherical alumina, 2-5 pts. wt. flake boron nitride, 6-9 pts. wt. graphite crystal whiskers, 0.1-1 pts. wt. surfactant, 0.2-2 pts. wt. viscosity adjustment, 0.5-3 pts. wt. dispersant, 0.1-1 pts. wt. antifoaming agent, and 0.5-1 pts. wt. antioxidant. USE - The application high thermal conductivity and low thermal resistance thermal conductive paste is used as heat dissipation material for electronic components (claimed). ADVANTAGE - The method achieves stacking between thermally conductive particles, solves the problem of high impedance and low thermal conductivity of traditional thermal paste, and prepares thermal paste with high thermal conductivity and low thermal resistance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing high thermal conductivity and low thermal resistance thermal conductive paste, comprising mixing graphene, spherical alumina, flake boron nitride and graphite crystal whiskers, subjecting to surfactant treatment to obtain surface modified thermal conductive filler, mixing surface-modified thermal conductive filler, silicon matrix, viscosity modifier, dispersant, antifoaming agent, and antioxidant, and vacuum degassing to obtain graphene-based high thermal conductivity and low thermal resistance thermal conductive paste.