• 专利标题:   Formation of metal-graphene hetero-junction metal interconnect for semiconductor device, involves depositing carbon source on substrate, depositing metal catalyst layer on carbon source layer, and heat treating substrate to form graphene.
  • 专利号:   US2017358486-A1, KR1795783-B1, CN107492507-A, US10134630-B2
  • 发明人:   HAM M, SON M, HAM M H, MYUNGWOO S, XIAN W, SUN M
  • 专利权人:   GWANGJU INST SCI TECHNOLOGY, GWANGJU INST SCI TECHNOLOGY
  • 国际专利分类:   H01L021/768, H01L023/522, H01L023/532, H01L021/285, H01L021/324, H01L021/60, H01L023/528, H01L023/48
  • 专利详细信息:   US2017358486-A1 14 Dec 2017 H01L-021/768 201802 Pages: 11 English
  • 申请详细信息:   US2017358486-A1 US617119 08 Jun 2017
  • 优先权号:   KR072067

▎ 摘  要

NOVELTY - Formation of a metal-graphene hetero-junction metal interconnect involves forming a carbon source (20) layer by depositing a carbon source on a top surface of a substrate (10), forming a metal catalyst layer (30) by depositing a metal catalyst on the carbon source layer, and synthesizing a graphene (40) with a portion of the carbon source layer in contact with the metal catalyst layer by carrying out heat treatment (S106) on the substrate. USE - Formation of metal-graphene hetero-junction metal interconnect used in semiconductor device (claimed). ADVANTAGE - The method is economical, requires less time, effectively forms metal-graphene hetero-junction metal interconnect having excellent electrical properties, stability. The interconnect enhances quality of semiconductor devices. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for semiconductor device. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view explaining the formation of metal-graphene hetero-junction metal interconnect. Substrate (10) Carbon source (20) Metal catalyst layer (30) Graphene (40) Heat treating of substrate (S106)