▎ 摘　　要

NOVELTY - The interconnection structure has a lower-layer wiring structure formed on a substrate. A shielding layer is formed on the lower-layer wiring structure and arranged with a graphene part and an upper-layer wiring structure. The graphene part is formed as a single crystal structure or multi-layer structure. The lower-layer wiring structure and the upper-layer wiring structure are staggered or overlapped with each other. The upper-layer wiring structure is formed with two insulation layers. A diffusion barrier layer is formed by interconnection metal material. USE - Interconnection structure. ADVANTAGE - The interconnection structure has less volume, and reduces line noise rate and improves interconnection precision. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for an interconnection structure forming method. DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of an interconnection structure.