▎ 摘　　要

NOVELTY - The radiating structure (1) has a radiating protective layer (12) formed on a metal layer (11). The radiating protective layer is provided with a laminated structure of a polymer material layer (121) and a heat dissipation coating layer (122). An adhesive layer is formed between the metal layer and the radiating protective layer. The heat dissipation coating layer is provided with a filling piece (1221) and a bonding piece (1222). The filling piece is mixed in the bonding piece. The filling piece is included with a graphene, a nano carbon tube, boron nitride, silicon carbide, aluminium nitride and ceramic nitride. USE - Radiating structure for use in an electronic device (claimed). ADVANTAGE - The radiating structure dissipates the heat generated by the heat source to the outer side rapidly, and improves the radiating efficiency of the electronic device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a heat dissipation structure of a radiating structure. 1Radiating structures 11Metal layer 12Radiating protective layer 13First adhesive layer 121Polymer material layer 122Heat dissipation coating layer 1221Filling piece 1222Bonding piece