▎ 摘　　要

NOVELTY - Condensation curable composition comprises silicone-imide base polymer (I), crosslinker, condensation cure catalyst and additive. USE - Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane (claimed). ADVANTAGE - The condensation curable composition is curable at room temperature in less than 24 hours. The cured material may exhibit stability to extreme temperature condition, and high heat stability and high thermal conductive property. DETAILED DESCRIPTION - Condensation curable composition comprises silicone-imide base polymer of formula (I), crosslinker, condensation cure catalyst and additive. R1=5-20C aryl or polycyclic aryl group comprising 5-20C aryl group, 1-6C alkyl (optionally substituted), halogen, haloalkyl, hydroxy, and 1-5C alkoxy group; C1=1-5C alkyl, 5-20C aryl, 7-16C arylalkyl, or 7-16C alkylaryl; R2, R3, and R4=1-3C alkyl or phenyl; R5=1-30C alkyl, 1-30C alkoxy group, 1-30C acetoxy group, or 1-30C ketoxime group; m=1-30; and n=1-200. INDEPENDENT CLAIMS are included for: 1. a cured silicone-imide material formed from the condensation curable composition; and 2. an article, which comprises substrate, and silicone-imide composition is coated or adhered on a surface of the substrate.