• 专利标题:   Manufacture of conductive polymer filler used in thermoplastic resin composition, involves preparing graphene microcapsules surrounded by thermoplastic fiber layer, and flocculating obtained microcapsules.
  • 专利号:   KR1198087-B1
  • 发明人:   KIM S H
  • 专利权人:   UNIV HANBAT NAT IND ACADEMIC COOP FOUND
  • 国际专利分类:   B01J013/14, C08K003/04, C08K009/10, C08L053/00
  • 专利详细信息:   KR1198087-B1 09 Nov 2012 C08K-009/10 201407 Pages: 12
  • 申请详细信息:   KR1198087-B1 KR120006 17 Nov 2011
  • 优先权号:   KR120006

▎ 摘  要

NOVELTY - (In parts weight) graphene (1) with average particle diameter of 0.1-500 mu m, water-soluble block copolymer (0.1-2), emulsifier (0.1-20) and water (50-1000) are emulsion polymerized in presence of ethylene type monomer to obtain graphene microcapsules surrounded by thermoplastic fiber layer. The obtained microcapsules are flocculated to obtain conductive polymer filler. USE - Manufacture of conductive polymer filler used in thermoplastic resin composition (claimed). ADVANTAGE - The conductive polymer filler provides excellent electrical property to the resin composition. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for thermoplastic resin composition, which contains the thermoplastic resin and the filler.