• 专利标题:   Graphite radiating layer integrated flip structure gallium nitride based power device, has gallium nitride-based HEMT device adhesively connected to substrate, where graphene material is utilized as heat dissipating material.
  • 专利号:   CN108376705-A
  • 发明人:   LIANG S
  • 专利权人:   BEIJING HUATAN TECHNOLOGY CO LTD
  • 国际专利分类:   H01L021/335, H01L021/50, H01L023/367, H01L023/373, H01L029/778
  • 专利详细信息:   CN108376705-A 07 Aug 2018 H01L-029/778 201858 Pages: 9 Chinese
  • 申请详细信息:   CN108376705-A CN10025888 11 Jan 2018
  • 优先权号:   CN10025888

▎ 摘  要

NOVELTY - The structure has electrode pads provided with a source electrode pad, a drain electrode pad and a gate electrode pad. A gallium nitride-based HEMT device is provided with an epitaxial layer structure and the gate electrode, the source electrode and the drain electrode. The gallium nitride-based HEMT device is adhesively connected to a substrate e.g. silicon carbide substrate and sapphire substrate through the electrode pad to realize a flip packaging structure, where a graphene material is utilized as a heat dissipating material on the substrate material of the flip of the gallium nitride-based HEMT device. The substrate is made of aluminum nitride or aluminum oxide material. USE - Graphite radiating layer integrated flip structure gallium nitride based power device. ADVANTAGE - The device can connect the HEMT device with the radiating film through an electrode pad, so that a graphene is utilized as a heat radiating layer on the inverted structure in the HEMT substrate, thus improving heat dissipation efficiency of the device and long-term reliability of the lifting device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a graphite radiating layer integrated flip structure gallium nitride based power device manufacturing method. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a graphite radiating layer integrated flip structure gallium nitride based power device.