• 专利标题:   Composite substrate for mounting vertical LED chip, has substrates which are made of graphene, copper tungsten, molebinum and silicon or silicon carbide and are in sequence order.
  • 专利号:   CN103249248-A, CN103249248-B
  • 发明人:   ZHANG J, SONG J, BU E, HOU X, LI F, MENG L
  • 专利权人:   UNIV XIAN JIAOTONG
  • 国际专利分类:   H01L033/54, H01L033/64, H05K001/03, H05K003/00
  • 专利详细信息:   CN103249248-A 14 Aug 2013 H05K-001/03 201376 Chinese
  • 申请详细信息:   CN103249248-A CN10156462 28 Apr 2013
  • 优先权号:   CN10156462

▎ 摘  要

NOVELTY - The composite substrate has substrates which are made of graphene, copper tungsten, molebinum and silicon or silicon carbide. The substrates are arranged in sequence order. The thickness of the substrates is set to predetermined range. USE - Composite substrate for mounting vertical LED chip (claimed). ADVANTAGE - The thermal conductivity and mechanical performance of the substrate can be improved, so that radiating performance of LED can be improved. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) manufacturing method of composite substrate; and (2) LED chip. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the LED structure. (Drawing includes non-English language text)