▎ 摘　　要

NOVELTY - The utility model relates to a power semiconductor module bottom plate, comprising a heat-conducting metal base plate is set with insulating plate and copper plate, the character is: the heat conducting metal base plate and the insulating plate are coated with graphene. it is between the heat-conducting metal base plate and insulating board coated on graphene, the insulating plate and the heat-conducting metal base plate heat conducting speed is improved, better heat-conducting property of the power semiconductor module base plate.