▎ 摘　　要

NOVELTY - The utility model claims a semiconductor device package structure with low thermal resistance, relating to the technical field of semiconductor device package. The utility model comprises a circuit board; a semiconductor chip and a packaging plate; the packaging plate is located on the upper surface of the semiconductor chip; the packaging plate is extruded and matched with the semiconductor chip; the upper surface of the packaging plate is provided with an opening groove and a thermal resistance pressing plate; the thermal resistance pressing plate is slidingly matched with the opening groove; the peripheral side of the thermal resistance pressing plate is provided with multiple sliding guide rails; the inner peripheral side of the packaging plate is provided with multiple guide rail grooves; the sliding guide rail is matched with the guide rail groove in sliding manner; the lower surface of the thermal resistance pressing plate is contact with the semiconductor chip. The utility model effectively improves the radiating ability by using the low thermal resistance of the thermal resistance pressing plate provided with graphene material, and can automatically adjust the longitudinal height of the thermal resistance pressing plate by setting the sliding guide rail so that it can increase the heat transfer effect with the semiconductor chip precisely; The whole packaging device can be detached conveniently by setting the rectangular groove and the sliding block so as to conveniently change and add the radiating silicone grease.