• 专利标题:   Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.
  • 专利号:   CN113622007-A, TW777783-B1, JP7187069-B1, EP4148165-A1, US2023070481-A1, KR2023036941-A, JP2023039376-A, TW202311157-A
  • 发明人:   PANG M, PANG M X, MACING F
  • 专利权人:   SUZHOU ANPAI PRECISION ELECTRONICS CO, SUZHOU ANPAI PRECISION ELECTRONICS CO, SUZHOU ONTAP PRECISION ELECTRONIC CO LTD, SUZHOU ONTAP PRECISION ELECTRONIC CO LTD, SUZHOU ONTAP PRECISION ELECTRONIC CO LTD, SUZHOU ONTAP PRECISION ELECTRONICS CO LTD
  • 国际专利分类:   C25D005/48, C25D003/38, C25D005/54, C01B032/194, C01B032/21, H01L023/373, H05K007/20, C25D005/10, F28F021/02, C25D005/56
  • 专利详细信息:   CN113622007-A 09 Nov 2021 C25D-005/54 202104 Chinese
  • 申请详细信息:   CN113622007-A CN11020365 08 Sep 2021
  • 优先权号:   CN11020365

▎ 摘  要

NOVELTY - Preparing high-flexibility graphite material or graphene material radiating component comprises (a) plasma cleaning the graphite or graphene raw material, (b) taking 10-20 wt.% sulfuric acid, 0.05-1 wt.% OP-10 surfactant, 0-1% sodium dodecyl sulfate, and balance amount of water, (c) mixing the components of the activating agent, preparing the activating catalyst, (d) continuously cleaning graphite and graphene raw materials by deionized water; (e) plating treatment on the surface of graphite raw materials to form a copper film layer; (f) washing he graphite or grapheme rawmaterial with copper film layer plated on the surface with deionizing water, (g) forming a protective film on the raw material by soaking; and (h) drying the raw product electroplated with the copper layer. USE - Preparation method of high-flexibility graphite material or graphene material radiating component. ADVANTAGE - The method provides high-flexibility graphite material or graphene material radiating component with high flexibility. The graphite or graphene surface after activating agent treatment, the copper film layer is good and uniform in electroplating, and the flexibility of the prepared radiating components is enhanced.