▎ 摘　　要

NOVELTY - A conductive slurry comprises 0.1-1 wt.% carbon material containing carbon nanotube and/or graphene, a dispersant and a binder, which are uniformly mixed in a solvent. USE - Conductive slurry for plating circuit board (claimed). ADVANTAGE - The conductive slurry enables formation of plated metal layer having improved adhesion and conductivity by simple method. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for plating method for circuit board (1), which involves placing the circuit board in the conductive slurry at room temperature for 3-10 minutes, forming a layer of the conductive slurry on surface of the through hole, cleaning the circuit board by water at room temperature for 1-60 seconds, drying the circuit board at 150-200degrees Fahrenheit for 5-20 minutes, immersing the circuit board in a micro-etching agent at room temperature for 15-90 seconds, cleaning the circuit board by water at room temperature for 15-90 seconds, performing anti-oxidation process at 50-150degrees Fahrenheit for 1-5 minutes, cleaning the circuit board by water at room temperature for 15-90 seconds, plating the circuit board at room temperature for 15 seconds to 15 minutes, forming a metal layer on the surface of the through hole, and drying the circuit board at 150-250degrees Fahrenheit for 1-10 minutes. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the circuit board. Circuit board (1) Upper surface (11) Lower surface (12) Non-conductive material (13)