▎ 摘　　要

NOVELTY - The utility model claims a honeycomb-shaped high power semiconductor quick heating device. comprising a power distribution box and a heating box; the water inlet box body is located at the bottom of the inner cavity of the heating box; the water outlet box body is located at the upper part of the inner cavity of the heating box; multiple groups of semiconductor heating pipes are arranged between the water inlet box body and the water outlet box body to form honeycomb-shaped arrangement combination; the upper end of each semiconductor heating pipe is connected to the water outlet box body through the stainless steel corrugated pipe; the lower end of each semiconductor heating pipe is connected to the water inlet box body through the stainless steel movable joint. The beneficial effects are as follows: using the graphene semiconductor arranged in honeycomb shape, making the heat more concentrated, reducing heat loss, circulating pump circulation better away heat, improving the heat efficiency, the mounting structure greatly reduces the volume of the device, reduces the weight of the product, reduces the manufacturing cost, high heat efficiency; In addition, the semiconductor heating heating pipe adopts three-layer heat preservation way, reducing heat loss, improving the heat preservation effect, reducing heat loss, the whole device heat efficiency is improved by more than 10 %.