▎ 摘　　要

NOVELTY - A graphene multilayer circuit board heating chip comprises a substrate layer, an electrode layer and a graphene layer provided on the surface of substrate layer, and a top layer provided on the graphene layer. The electrode layer is connected with the graphene layer. The substrate layer is an epoxy resin glass fiber plate. The top layer is an epoxy resin glass cloth. USE - Graphene multilayer circuit board heating chip. ADVANTAGE - The graphene multilayer circuit board heating chip has a highest working temperature of 220 degrees C or more and a stable working temperature of 30-180 degrees C. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the graphene multilayer circuit board heating chip, which involves coating copper on the surface of substrate layer to form a copper-clad substrate layer, forming an electrode layer on the copper-clad substrate layer, forming a graphene layer on the substrate layer by printing, and forming a top layer on the substrate layer by pasting the top layer material and pressing at high temperature.