• 专利标题:   Nickel-plated graphene-reinforced phenolic resin-based composite material comprises nickel-plated graphene, urea, aqueous ammonia, ammonium sulfate, silicone oil, silane coupling agent and phenolic resin.
  • 专利号:   CN110194880-A
  • 发明人:   CHEN Z, ZHANG D
  • 专利权人:   SUQIAN NUAA NEW MATERIALS EQUIP MFG
  • 国际专利分类:   B29C070/48, C08K013/06, C08K003/04, C08K003/28, C08K005/21, C08K005/54, C08K009/02, C08L061/06, C08L083/04, H05K009/00
  • 专利详细信息:   CN110194880-A 03 Sep 2019 C08L-061/06 201974 Pages: 5 Chinese
  • 申请详细信息:   CN110194880-A CN10431754 16 May 2019
  • 优先权号:   CN10431754

▎ 摘  要

NOVELTY - A nickel-plated graphene-reinforced phenolic resin-based composite material comprises 5-20 pts. wt. nickel-plated graphene, 3-5 pts. wt. urea, 1 pt. wt. aqueous ammonia, 2-4 pts. wt. ammonium sulfate, 5-8 pts. wt. silicone oil, 3-5 pts. wt. silane coupling agent and 50-80 pts. wt. phenolic resin. USE - Nickel-plated graphene-reinforced phenolic resin-based composite material. ADVANTAGE - The nickel-plated graphene-reinforced phenolic resin-based composite material prepared has light weight, high strength, corrosion resistance, high temperature resistance, excellent heat dissipation, and absorbing performance, and can achieve electromagnetic shielding in a wide frequency band. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of nickel-plated graphene-reinforced phenolic resin-based composite material which involves using graphene oxide sheets as a matrix and sodium borohydride as a reducing agent, preparing nickel-plated graphene in nickel sulfate solution, washing in a mixture of deionized water and ethanol, drying at 100-125 degrees C, adding 4 pts. wt. urea and 1 pt. wt. aqueous ammonia, stirring for 0.5 minute, adding 6.5 pts. wt. silicone oil and 4 pts. wt. silane coupling agent to the stirring tank, stirring for 1-2 minutes, adding 65 pts. wt. phenolic resin to the stirred tank mixture, stirring to obtain a phenolic resin glue, placing nickel-plated graphene in a closed cavity using a resin transfer molding process, injecting a phenolic resin glue into the cavity, solidifying the molding and curing at 180-220 degrees C and at pressure of 0.4-0.7 MPa.