• 专利标题:   Preparation method of transparent metal grid conductive film, involves curing conductive paste filled in groove, and graphene and metal nano-particles which are grown on surface are closely contacted to metal grid wiring.
  • 专利号:   CN106373664-A, CN106373664-B
  • 发明人:   FAN J, LI L, LIU T, REN X, XIE L
  • 专利权人:   BEIJING HUANA HITECH CO LTD
  • 国际专利分类:   B82Y030/00, B82Y040/00, H01B001/02, H01B001/04, H01B013/00, H01B005/00, H01B005/14
  • 专利详细信息:   CN106373664-A 01 Feb 2017 H01B-013/00 201716 Pages: 14 Chinese
  • 申请详细信息:   CN106373664-A CN10436780 23 Jul 2015
  • 优先权号:   CN10436780

▎ 摘  要

NOVELTY - The method involves providing a transparent substrate (110) comprising the first and second surfaces (1101,1102) which are arranged alternately. The fine line width of a groove is formed in substrate of first surface. The graphene/metal nano-particles composite conductive paste is prepared, and metal nanoparticle is grown on a graphene surface. The conductive paste is coated in groove, and then un-filled mesh groove is removed. The conductive paste filled in groove is cured, and graphene and metal nano-particles which are grown on surface are closely contacted to metal grid wiring. USE - Preparation method of metal grid transparent conductive film. ADVANTAGE - The continuity of the metal grid wiring is excellent, the electrical conductivity, the chemical stability and the flexibility of the film are improved, the metal nano particles can be prevented from being oxidized and the water vapor can be prevented from entering into the film, and the metal migration is eliminated. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a transparent metal grid conductive film. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of the metal wiring on the first surface of the transparent substrate. Transparent substrate (110) First and second grid metal wirings (213,214) Functional layer (309) Socket layer (310) First and second surfaces (1101,1102)