▎ 摘 要
NOVELTY - A silicon carbide fin having at least bare sidewalls is provided on a surface of a substrate, and a graphene nanoribbon is formed on each bare sidewall of silicon carbide fin. The graphene nanoribbon is formed and annealed at 1200 degrees C beyond the melting point of substrate and at least a gate structure is formed adjacent graphene nanoribbon, to obtain semiconductor structure. USE - Manufacture of semiconductor structure used as device channels. ADVANTAGE - The semiconductor structure is efficiently manufactured with excellent electronic property. DESCRIPTION OF DRAWING(S) - The drawing shows the top down view of manufacture of semiconductor structure after forming silicon carbide fins. Buried insulating layer (14) Hard mask (30) Patterned hard mask (30')