• 专利标题:   Boron nitride-doped thermally conductive enhanced agent used for curing resin in preparation of adhesive or polymer coating, is prepared by peeling and grafting boron nitride by co-grinding of melamine and boron nitride, and reacting ground mixture and formaldehyde under alkaline condition.
  • 专利号:   CN114907790-A
  • 发明人:   WANG G, YAO X, JIANG S, SHAO L
  • 专利权人:   SHANGHAI KUYAO NEW MATERIAL CO LTD
  • 国际专利分类:   C09D133/00, C09D007/62, C09D007/63, C09J011/04, C09J011/06
  • 专利详细信息:   CN114907790-A 16 Aug 2022 C09J-011/04 202289 Chinese
  • 申请详细信息:   CN114907790-A CN10617657 01 Jun 2022
  • 优先权号:   CN10617657

▎ 摘  要

NOVELTY - A boron nitride-doped thermally conductive enhanced curing agent is prepared by peeling and grafting boron nitride by co-grinding of melamine and boron nitride, and reacting the ground mixture (without separation), and formaldehyde under alkaline condition. USE - Boron nitride-doped thermally conductive enhanced agent used for curing alkyd resin, acrylic resin and polyol resin after etherification reaction, in preparation of adhesive and polymer coating (all claimed) for preparing high-molecular nano-composite material. ADVANTAGE - The curing agent can be cured through self-crosslinking reaction, and solves technical problem by using boron nitride as thermally conductive filler, which is difficult to disperse in polymer materials and has high interface thermal resistance, so that it is difficult to exert the high thermal conductivity of boron nitride, and is prepared by simple preparation process. Compared with other thermally conductive fillers such as graphene, graphite and metal, the boron nitride has excellent insulating performance.