▎ 摘　　要

NOVELTY - The method involves providing a circuit substrate, where the circuit substrate comprises a transparent substrate layer (12), a surface blackening layer (13) and a surface copper layer (14) stacked in sequence. A dry film is pressed on a surface of the copper layer that deviates from the base layer. The dry film on the surface is patterned to expose a portion of the bottom copper layers. A graphene layer (40b) is formed on the graphene layer on the copper layers surface. The dried film is removed. The copper layer is removed from the outside of a graphene layer to form a circuit layer (50b) to obtain a transparent circuit board (100b). USE - Manufacturing method of transparent circuit board (claimed). Uses include but are not limited to smart battery, mobile phone screen, augmented reality (AR) glasses and vehicle-mounted transparent antenna. ADVANTAGE - The circuit layer can be prevented from falling-off easily due to external force by setting a graphene layer with strong chemical stability as the outermost layer of the circuit layer, thus improving the yield of the transparent circuit board. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a transparent circuit board DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of the transparent circuit board obtained by removing the surface copper layer and the blackening layer except the metal layer to form a circuit layer. Transparent substrate layer (12) Surface blackening layer (13) Surface copper layer (14) Metal surface (30b) Graphene layer (40b) Circuit layer (50b) Transparent circuit board (100b)