▎ 摘　　要

NOVELTY - Graphene-doped epoxy resin conductive adhesive comprises 29-37 wt.% carbon black, 1.95-2.95 wt.% loaded nano silver particles reduction graphene, 1.95-2.95 wt.% carbon nanotube fiber, 1.95-2.95 wt.% copper-nickel alloy nanowires, 1.95-2.95 wt.% silicon dioxide magnetic microspheres, 7.50-9.50 wt.% curing agent, 16-18 wt.% active diluent, 1.10-1.90 wt.% of coupling agent, and epoxy resin (remaining amount). USE - Used as graphene-doped epoxy resin conductive adhesive. ADVANTAGE - The adhesive: improves the safety and stability of epoxy resin conductive adhesive; makes the conductive adhesive can be used for a long time under different temperature, different strong acid and alkali environment; maintains normal adhesion and connection performance and electrical conductivity; improves the performance of carbon black and epoxy resin; and strengthens the heat resistance, stability and acid and alkali resistance of epoxy resin conductive adhesive. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the graphene-doped epoxy resin conductive adhesive, comprising (i) taking the above mentioned components according to their composition, (ii) ultrasonically dispersing the one-fifth pts. wt. carbon black and one-third pts. wt. loaded nano silver particles reduction graphene to obtain modified carbon black A, ultrasonically vibrating and dispersing the one-fifth pts. wt. carbon black and one-third pts. wt. carbon nanotube fibers to obtain modified carbon black B, ultrasonically vibrating and dispersing on one-fifth pts. wt. carbon black and one-third pts. wt. copper-nickel alloy nanowire to obtain modified carbon black C, and ultrasonically vibrating and dispersing the one-fifth pts. wt. carbon black and one-third pts. wt. silicon dioxide magnetic microspheres to obtain modified carbon black D, (iii) ultrasonically vibrating and dispersing the one-fifth pts. wt. epoxy resin and one-third pts. wt. reduced graphene loaded the nano silver particles to obtain modified epoxy resin A, ultrasonically vibrating and dispersing the one-fifth pts. wt. epoxy resin and one-third pts. wt. carbon nanotube fibers in step 1 to obtain modified epoxy resin B, ultrasonically vibrating and dispersing the one-fifth pts. wt. epoxy resin and one-third pts. wt. copper-nickel alloy nanowires to obtain modified epoxy resin C, and ultrasonically vibrating and dispersing the one-fifth pts. wt. epoxy resin and one-third pts. wt. silicon dioxide magnetic microspheres to obtain modified epoxy resin D, (iv) ultrasonically vibrating and dispersing remaining carbon black, loaded nano silver particles reduction graphene, carbon nanotube fibers, copper-nickel alloy nanowires, silicon dioxide magnetic microspheres and epoxy resin to obtain modified base material E, (v) uniformly mixing the modified carbon black A, modified carbon black B, modified carbon black C, and modified carbon black D obtained in the step (ii) to obtain a complex modified carbon black, (vi) ultrasonically vibrating and dispersing the quarter pts. wt. complex modified carbon black obtained in the step (v) and the modified epoxy resin A obtained in the step (iii) to obtain modified base material F, ultrasonically vibrating and dispersing the one-fourth pts. wt. complex modified carbon black obtained in the step (v) and the modified epoxy resin B obtained in the step (iii) to obtain modified base material G, ultrasonically vibrating and dispersing the quarter pts. wt. complex modified carbon black obtained in the step (v) and the modified epoxy resin C obtained in the step (iii) to obtain modified base material H, and ultrasonically vibrating and dispersing the quarter pts. wt. complex modified carbon black obtained in the step (v) and the modified epoxy resin D obtained in the step (iii) to obtain modified base material I, and (vii) mixing the modified base material E obtained in the step (iv) with the modified base material F, modified base material G, modified base material H, modified base material I obtained in the step (vi) and reactive diluent, raising the temperature at 50-60 degrees C, stirring for 1-2 hours, continuously adding coupling agent and curing agent, raising the temperature at 63-67 degrees C, ultrasonically oscillating for 2-3 hours.