▎ 摘　　要

NOVELTY - High-efficiency heat-resistant graphene film comprises 5-7 pts. wt. bisphenol A, 30-40 pts. wt. thionyl chloride, 100-110 pts. wt. graphene, 10-14 pts. wt. ricinoleic acid, 8-10 pts. wt. pentaerythritol, 1-2 pts. wt. stearate and 40-50 pts. wt. modified solution. USE - The high-efficiency heat-resistant graphene film is used as an integrated circuit films. ADVANTAGE - The graphene film has excellent composite properties, high uniformity and stability, and superior comprehensive performance and has high-temperature resistance stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the high-efficiency heat-resistant graphene film, comprising (a) taking ricinoleic acid, adding into thionyl chloride, stirring uniformly, adding graphene, raising the temperature to 55-60 degrees C, keeping the temperature for 1-2 hours, distilling to remove thionyl chloride to obtain acidified graphene, (b) taking pentaerythritol, adding into the modified solution, uniformly stirring, mixing with the acidified graphene, raising the temperature to 40-50 degrees C, keeping the temperature for 15-20 hours, discharging, adding bisphenol A, raising the temperature to 70-80 degrees C, keeping the temperature for 100-130 minutes, performing suction filtration, washing the precipitate with dimethylformamide, drying at 50-60 degrees C for 5-7 hours, and cooling to room temperature to obtain the heat-resistant modified graphene, and (c) taking the heat-resistant modified graphene, mixing the heat-resistant modified graphene with the stearate, adding the heat-resistant modified graphene into dimethylformamide at the weight of 13-20 times the weight of the mixture, keeping the temperature at 85-90 degrees C for 100-140 minutes, uniformly coating the glass plate, drying for 10-13 hours at 70-75 degrees C, discharging and cooling, and uncovering the film to obtain the high-efficiency heat-resistant graphene film.