• 专利标题:   Seedless method for forming semiconductor graphene hybrid, used in optoelectronic applications, comprises forming a graphene sheet on a support, and exposing the formed supported graphene sheet to a solution having a semiconductor metal ion.
  • 专利号:   US2013099196-A1, US8878157-B2
  • 发明人:   WU J, LIU J
  • 专利权人:   UNIV KANSAS
  • 国际专利分类:   B82Y040/00, H01L021/36, H01L029/06, B82Y030/00, H01L021/02, H01L029/16, H01L033/00, H01L033/18
  • 专利详细信息:   US2013099196-A1 25 Apr 2013 H01L-021/36 201330 Pages: 19 English
  • 申请详细信息:   US2013099196-A1 US655656 19 Oct 2012
  • 优先权号:   US549464P, US655656

▎ 摘  要

NOVELTY - Seedless method for forming a semiconductor graphene hybrid, comprises: forming a graphene sheet on a support to form a supported graphene sheet having a graphene face; and exposing the supported graphene sheet to a solution comprising a semiconductor metal ion at a temperature below 100degree C for a time so that the semiconductor grows on the graphene sheet, where the exposing occurs without seeding the graphene sheet. USE - The seedless method is useful for forming a semiconductor graphene hybrid (claimed), which is useful in optoelectronic applications including photovoltaics, photodetection and photocatalysis. ADVANTAGE - The method: does not require a step of seeding the graphene sheet; and provides the semiconductor-graphene hybrid having an electrical conductivity that is substantially the same as the graphene sheet alone (all claimed), high mobility (and hence has high electrical conductivity of charge carriers), extremely thin electrode (graphene may be one layer of carbon atoms) and flexibility (if the graphene is supported by flexible support) in a low-cost and robust scheme for large-scale fabrication of semiconductor nanostructures on graphene. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for the semiconductor-graphene hybrid prepared by the method. DESCRIPTION OF DRAWING(S) - The drawing shows the overview of seedless