▎ 摘　　要

NOVELTY - Preparing thermal interface material comprises sequentially subjecting blank material to first orientation, second orientation, and solidification to obtain the thermal interface material. USE - Method for preparing thermal interface material used in electronic chip (claimed). ADVANTAGE - The method provides heat conducting interface material with high heat conductivity coefficient, high resilience, low hardness and excellent anti-aging characteristics. The method is simple, easy to implement, high stability and high consistency, and has high production efficiency and low cost. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a thermally conductive interface material, which is prepared by using the preparation method.