▎ 摘　　要

NOVELTY - Epoxy molding compound comprises (a) a hardener, (b) an inorganic based filler, where the amount of the inorganic based filler comprises greater than 80 wt.% of the epoxy molding compound, (c) a catalyst to accelerate curing of the epoxy molding compound, and (d) a conductive additive, where the amount of the conductive additive comprises 0.1-5 wt.% of the epoxy molding compound. USE - The epoxy molding compound is used in fluid ejection device for encapsulating fluidic dies to prevent electrostatic discharge (ESD) strikes from dissipating towards the fluidic die, and preventing cascading failures. ADVANTAGE - The epoxy molding compound is cost-effective and reduces the resistivity to as low as 6.5 x 104Ω .cm at 2 wt.% filler loading and with a low percolation threshold to maintain the viscosity of the epoxy molding compound for moldability and flow uniformity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: a fluid ejection device, comprising (A) a reservoir body to store a printing fluid, and (B) a printhead coupled to the reservoir body, where the printhead comprises (B1) an electrical pad, and (B2) a fluidic die electrically connected to the electrical pad, where the fluidic die comprises silicon slivers encapsulated with a conductive grade epoxy molding compound; and a method for fabricating the fluidic die, comprising (i) preparing a conductive grade epoxy molding compound, (ii) molding the conductive grade epoxy molding compound on a substrate populated by preplaced silicon slivers to form fluidic dies comprising the silicon slivers overmolded with the conductive grade epoxy molding compound, (iii) curing the conductive grade epoxy molding compound to form an overmolded panel, and (iv) cutting the overmolded panel into individual fluidic dies.