• 专利标题:   Mobile phone board has graphene thermal conductive adhesive layer that is coated at surface of intermediate substrate which is provided with through-hole connected with upper and lower surfaces.
  • 专利号:   CN108540611-A, CN208386615-U
  • 发明人:   WU F, CENG Z, WEN J, ZENG J
  • 专利权人:   SHENZHEN LAIBIDE TECHNOLOGY CO LTD
  • 国际专利分类:   C09J011/04, C09J161/06, C09J163/00, C09K005/14, H04M001/02
  • 专利详细信息:   CN108540611-A 14 Sep 2018 H04M-001/02 201868 Pages: 7 Chinese
  • 申请详细信息:   CN108540611-A CN10451679 12 May 2018
  • 优先权号:   CN10451679, CN20703608

▎ 摘  要

NOVELTY - The mobile phone board has a graphene thermal conductive adhesive layer (1) that is coated at a surface of an intermediate substrate (2). A portion of the graphene thermal conductive adhesive layer is sprayed on both the upper and lower surfaces of the intermediate substrate. The intermediate substrate is provided with a through-hole which is connected with the upper and lower surfaces. USE - Mobile phone board. ADVANTAGE - The mechanical intensity and heat-conducting capability of the mobile phone board are improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing mobile phone board. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the mobile phone board. Graphene thermal conductive adhesive layer (1) Intermediate substrate (2)