▎ 摘　　要

NOVELTY - Thermal interface material (405) comprises a three-dimensional interconnected porous graphene (3D-IPG) foam structure constructed of three-dimensional interconnected graphene sheets formed as many layers, comprising many monolayers or few layers, where the graphene sheets have an flexible interconnection architecture, and the flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source (401) and a heat sink (403) across the interface, and by capping small features up to nanoscale roughened surfaces. USE - The thermal interface material is useful for increasing thermal conduction or thermal dissipation across an interface (claimed). ADVANTAGE - The thermal interface material: reduces thermal resistance between the mating surfaces, thus providing high interfacial thermal conductance and a high surface area; and creates a pressure insensitive thermal interfacial resistance which results in 3D-IPG functioning as effective heat dissipater, heat sink or heat convector (claimed). DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for producing the thermal interface material, comprising providing the (3D-IPG) foam structure constructed of three dimensional interconnected graphene sheets formed as many monolayers by chemical vapor deposition from a sacrificial template, where the graphene sheets have an interconnection architecture, and placing the 3D-IPG porous foam structure at an interface between a heat source and a heat sink and applying pressure across the interface, where the 3D-IPG foam structure provides a flexible interconnection architectures, allowing the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, thus reducing thermal resistance between the mating surfaces and providing high thermal conductivity and a high surface area to 3D-IPG function as an effective heat dissipater, heat sink or heat convector. DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of a thermal management system based on three-dimensional interconnected porous graphene thermal interface material with an encapsulant layer. Heat source (401) Heat sink (403) Thermal interface material (405) Encapsulant material (409)