▎ 摘　　要

NOVELTY - The LED chip has an undoped aluminum nitride buffer layer (2) that is sequentially laminated on a substrate (1). An indium gallium nitrogen sub layer and multiple gallium nitride sub-layers are laminated alternately. The N-type electrode (9) is provided on N-type gallium nitride layer (4) in a groove, and the P-type electrode (10) is provided on a graphene film layer. The titanium dioxide nanorods (11) are arranged in an array manner on the graphene film layer. An outer surface of the titanium dioxide nanorods is provided with multiple silver nanoparticles (12). USE - LED chip. ADVANTAGE - The plasmons and electrons resonate at the same frequency, so that the light waves are enhanced and the luminous efficiency of the LED is improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a LED chip manufacturing method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the LED chip. Substrate (1) Undoped aluminum nitride buffer layer (2) N-type gallium nitride layer (4) N-type electrode (9) P-type electrode (10) Titanium dioxide nanorod (11) Silver nanoparticle (12)