• 专利标题:   Fluorine rubber sealing element useful for e.g. processing semiconductor, modern aviation, missile, rocket, naval vessel and high-tech fields, comprises fluorine rubber, rubber surface modified graphene, filler, accelerator, cross-linking agent, acid absorbing agent and processing auxiliary agent.
  • 专利号:   CN115948010-A
  • 发明人:   CUI C, YE Y, HE H, HUANG R
  • 专利权人:   SHANGHAI SIEG PRECISION TECHNOLOGY CO
  • 国际专利分类:   C08K003/04, C08K005/136, C08K005/14, C08K009/10, C08L027/12
  • 专利详细信息:   CN115948010-A 11 Apr 2023 C08L-027/12 202342 Chinese
  • 申请详细信息:   CN115948010-A CN11518898 30 Nov 2022
  • 优先权号:   CN11518898

▎ 摘  要

NOVELTY - Fluorine rubber sealing element comprises 100 pts. wt. fluorine rubber, 5-15 pts. wt. rubber surface modified graphene, 0-30 pts. wt. filler, 1-5 pts. wt. accelerator, 1-3 pts. wt. cross-linking agent, 0-5 pts. wt. acid absorbing agent and 0-5 pts. wt. processing auxiliary agent. USE - The sealing element is useful for processing semiconductor (claimed), modern aviation, missile, rocket, naval vessel, atomic and semiconductor industry and high-tech fields. ADVANTAGE - The sealing element can tolerate complex medium, and has high hardness, high tensile strength, high compressive deformation resistance and excellent reinforcing material, so that the obtained composite material has excellent strong acid e.g. cleaning liquid for semiconductor industry, strong alkali, strong oxidizing medium performance, and improves the hardness and tensile-strength of the rubber. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the sealing element, comprises adding the fluorine rubber into the open mill and uniformly plasticating, adding the fluororubber surface modified graphene, filler, accelerator, crosslinking agent, acid absorbing agent and processing auxiliary agent to the internal mixer and uniformly mixing, transferring gained mixture to open mill and uniformly mixing, obtaining the rubber compound after thinning and sheeting, placing the mixed rubber in forming mold, performing one-stage vulcanization on flat vulcanizer, vulcanizing at 160-180℃ for 10-30 minutes, cooling and demolding, placing it in vacuum oven for two-stage vulcanization, and vulcanizing for 18-32 hours at 200-220℃ to obtain the fluororubber seal for semiconductor processing.