• 专利标题:   Silver-tin-graphene composite bonding wire, comprises graphene, tin, silver and unavoidable impurities at specific weight percentage.
  • 专利号:   CN107768338-A
  • 发明人:   SU F, WU G, CHEN W, ZHENG T, MA L, WANG Y, YUAN L
  • 专利权人:   SICHUAN WINNER SPECIAL ELECTRONIC MATERI
  • 国际专利分类:   H01L021/48, H01L023/49
  • 专利详细信息:   CN107768338-A 06 Mar 2018 H01L-023/49 201825 Pages: 11 Chinese
  • 申请详细信息:   CN107768338-A CN10877543 26 Sep 2017
  • 优先权号:   CN10877543

▎ 摘  要

NOVELTY - A silver-tin-graphene composite bonding wire comprises 0.05-1.5 wt.% graphene, 5-10 wt.% tin, 88.5-94.95 wt.% silver and unavoidable impurities. USE - Silver-tin-graphene composite bonding wire. ADVANTAGE - The bonding wire reduces the packaging cost and effectively overcomes insufficient push-pull force occurs during bonding of gold-silver alloy wire and palladium plating copper, poor soldering at the two solder joints and bonding defects such as a solder ball, solder joints and the bonding performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for preparing silver-tin-graphene composite bonding wire.