▎ 摘　　要

NOVELTY - A semiconductor-based optimizing heat conducting structure of graphene, comprising a single radiator sheet of metal graphene sheet, wherein the single graphene sheet are connected with the metal radiator and a heat conducting plate face is set on the semiconductor contact, single graphene sheet is a single layer structure, double-layer structure or multi-layer structure. In the utility model, the single graphene sheet folded and arranged between the semiconductor heat source and the metal radiator and are respectively contacted so as to optimize heat dissipation surface with it. The utility model can fully develop the graphene is as high as the thermal conductivity of 1500-1700w/mk and thermal diffusion rate is high, so it can quickly reduce the hot spot (heat accumulated point) temperature, heat dissipation of the semiconductor circuit.