▎ 摘　　要

NOVELTY - Preparing high heat-conducting copper-clad plate comprises (i) stirring 25-35 pts. wt. polyimide resin, 10-20 pts. wt. micro-capsule silicon nitride, 1-5 pts. wt. by modified graphene and 70-90 pts. wt. acetone at 25-35℃ at 200-300 revolutions/minute for 0.5-1.5 hours to obtain the heat conducting colloid; (ii) polishing and coarsening each plane of the copper plate and the aluminum plate, where the surface of the roughness reaches Ra= 25-100; and (iii) coating heat conducting colloid layer uniformly on the polished and roughened plane of the aluminum plate to form a heat conducting glue layer, bonding the copper plate with the heat conducting glue layer through grinding and coarsening plane to obtain the composite plate with three-layer sandwich structure and drying the composite plate for 1-3 hours at 230-250℃. USE - The method is useful for preparing high heat-conducting copper-clad plate is useful in electronic device, microelectronic integrated technology and logic electronic component volume. ADVANTAGE - The high heat-conducting copper-clad plate has good thermal conductivity and high breakdown voltage. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a high heat-conducting copper-clad plate, prepared as mentioned above.