• 专利标题:   Preparation of structured graphene by depositing silicon dioxide layer on silicon carbide surface, etching pattern window, reacting silicon carbide with chlorine, removing silicon dioxide outside window, putting on copper film and annealing.
  • 专利号:   CN102674332-A
  • 发明人:   DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG F
  • 专利权人:   UNIV XIDIAN
  • 国际专利分类:   C01B031/04, H01L021/02
  • 专利详细信息:   CN102674332-A 19 Sep 2012 C01B-031/04 201338 Pages: 7 Chinese
  • 申请详细信息:   CN102674332-A CN10162384 23 May 2012
  • 优先权号:   CN10162384

▎ 摘  要

NOVELTY - Preparation of structured graphene by reaction of silicon carbide (SiC) and chlorine (Cl2) based on copper (Cu) film annealing includes washing SiC samples regularly; depositing a layer of silicon dioxide (SiO2) on the surface of washed SiC samples; etching a pattern window; putting the window opened samples in a quartz tube; reacting SiC with Cl2 to form carbon film; putting the carbon samples in hydrofluoric acid buffer solution to remove SiO2 outside the window; putting the SiO2-removed carbon samples on Cu film; placing in argon (Ar) atmosphere; and annealing. USE - Preparation of structured graphene (claimed) used for preparing microelectronic devices. ADVANTAGE - The method is simple; has high safety; and provides structured graphene with smooth surface, good continuity, and low porosity. DETAILED DESCRIPTION - Preparation of structured graphene by reaction of SiC and Cl2 based on Cu film annealing comprises: (A) washing SiC samples regularly to remove the pollutants; (B) depositing a layer of SiO2 having a thickness of 0.4-1.2 mu m as cover film by plasma enhanced chemical vapor deposition (PECVD) method; (C) coating a layer of photoresist on the cover film; etching a pattern window of the same shape of desired device substrate; and exposing SiC to form structured pattern; (D) putting the window opened samples in quartz tube; and heating at 700-1100 degrees C; (E) charging Ar and Cl2 mixed gas in the tube for 4-10 minutes to react Cl2 with SiC and form carbon film; (F) putting the carbon samples in hydrofluoric acid buffer solution to remove SiO2 outside window; and (G) putting the SiO2-removed carbon samples on Cu film; placing in Ar atmosphere; annealing at 900-1200 degrees C for 15-25 minutes to make the carbon film reconstruct into structured graphene at the window; and taking out the Cu film from the graphene samples.