▎ 摘　　要

NOVELTY - The microchip (13) has a heat dissipating enclosure (16) containing graphene which is embedded into a wrapping material. The graphene structures (19) are grown on material of microchip which is wrapped with graphene structure (15). The graphene structures are extended away from outside of enclosure. The graphene structures (15,18) are connected to microchip through substrate (11). The recesses such as holes (22) are filled with graphenes. The microchip is formed as a sandwich construction consisting of graphene structures and wafer material. USE - Microchip of microchip arrangement (claimed), for use in computer. ADVANTAGE - The microchip with improved heat dissipation effect and good thermal contact is provided. The heat can be transferred from microchip in very effective manner without use of fans. The operating noise of computer can be reduced. DESCRIPTION OF DRAWING(S) - The drawings show the sectional views of the microchip arrangement stacked with three microchips on substrate, single microchip mounted on substrate and microchip before assembly. Substrate (11) Microchip (13) Graphene structures (15,18,19) Enclosure (16) Holes (22)