• 专利标题:   Graphene circuit board comprises conductive layer formed on surface of substrate, and set of components formed by laser engraving process e.g. resistance, directly engraved on layer, where layer is made of graphene material.
  • 专利号:   CN114786332-A
  • 发明人:   DING J, FANG Z, XUE W, CHEN R, WEI Y
  • 专利权人:   CHAOZHOU XITAO NEW MATERIAL CO LTD
  • 国际专利分类:   H05K001/03, H05K003/00
  • 专利详细信息:   CN114786332-A 22 Jul 2022 H05K-001/03 202274 Chinese
  • 申请详细信息:   CN114786332-A CN10421844 21 Apr 2022
  • 优先权号:   CN10421844

▎ 摘  要

NOVELTY - Graphene circuit board comprises substrate and conductive layer. The conductive layers are formed on the surface of the substrate. The conductor layer is made of graphene material. Multiple components are arranged on the conductor layer. Multiple lines of circuits are laser engraved on the conducting layer, and are connected with multiple components to form complete circuit. The multiple components can be formed by laser engraving process e.g. resistance, and directly engraved on the conductivity layer. USE - Used as graphene circuit board. ADVANTAGE - The graphene circuit board solves the technical problem that the current technology cannot make the circuit diluent and more integrated. The graphene material is convenient for adjusting conductivity of the conductive layer, and some components can be formed by laser engraving process e.g. resistance and so on, directly by laser carving is set on the conductor layer on the base material, so as to change the size of the component e.g. thickness and length. The resistance of the resistor can be set with different length and thickness of resistor, so that the height integration of the circuit board can be realized. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for graphene line manufacturing method. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of the graphene circuit board. 1High temperature resistant insulating substrate 2Graphene conductive layer