▎ 摘　　要

NOVELTY - Preparing composite graphene high thermal conductivity low specific gravity flame retardant organosilicone encapsulant comprises mixing mixture of component A and component B, when the fluidity of the mixture is still present, pouring into equipment and curing at room-temperature or performing heat-hardening, where the component A comprises vinyl silicone oil, modified heat conductive powder filler, catalyst and flame retardant, the component B comprises vinyl silicone oil, graphene composite thermal conductive filler, hydrogen-containing silicone oil, inhibitor and flame retardant. USE - The method is useful for preparing composite graphene high thermal conductivity low specific gravity flame retardant organosilicone encapsulant. ADVANTAGE - The organosilicone encapsulant: has surface treated and compounded different thermally conductive fillers and graphene compound thermal conductive filler, which improves dispersion of the thermally conductive filler and the organosilicone rubber; contains graphene composite thermally conductive filler, which can increase the thermal conductivity. DETAILED DESCRIPTION - Preparing composite graphene high thermal conductivity low specific gravity flame retardant organosilicone encapsulant comprises mixing mixture of component A and component B according to 1:1-2 weight ratio, when the fluidity of the mixture is still present, pouring into equipment and curing at room-temperature or performing heat-hardening, where the component A comprises 47.4-61.6 wt.% vinyl silicone oil, 3-12 wt.% modified heat conductive powder filler, 0.4-0.6 wt.% catalyst and 35-40 wt.% flame retardant, the component B comprises 41.99-57.992 wt.% vinyl silicone oil, 3-12 wt.% graphene composite thermal conductive filler, 4-6 wt.% hydrogen-containing silicone oil, 0.005-0.008 wt.% inhibitor and 35-40 wt.% flame retardant.