▎ 摘　　要

NOVELTY - Strengthening interfacial bonding force of metal and insulating substrate, (1) pretreating the surface and/or pore structure of the insulating substrate; (2) coating the prepared graphene dispersion liquid on the surface and/or pore structure of the charge-adjusted insulating substrate obtained in step (1), and drying to form a conductive layer for metal plating; and (3) graphene and electroplated metal in conductive layer forming physical interpenetrating network structure; graphene dispersion liquid comprises water, graphene, bonding auxiliary agent and water-soluble conductive polymer, the bonding auxiliary agent enhances the covalent connection between the conductive layer and the electroplated metal during the electroplating process, and at same time interacts with the pretreated insulating substrate surface and/or groups of the pore structure. Substrate comprises surface and pore structure that is sunken on surface. USE - The method is useful for strengthening interfacial bonding force of metal and insulating substrate in electroplating process, preferably for flexible circuit board, and metallization of non-metallic surfaces. ADVANTAGE - The method: used insulating substrate uses graphene as binding medium to achieve a firm connection with metal, at same time, according to change of graphene processing, conductive layer also has flexibility of micro-morphology and adjustable position.