• 专利标题:   Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.
  • 专利号:   CN115772695-A
  • 发明人:   CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K
  • 专利权人:   CHINESE ACAD SCI CHEM INST
  • 国际专利分类:   C09D005/24, C25D005/54, C25D005/56, H05K003/42
  • 专利详细信息:   CN115772695-A 10 Mar 2023 C25D-005/54 202328 Chinese
  • 申请详细信息:   CN115772695-A CN11049013 08 Sep 2021
  • 优先权号:   CN11049013

▎ 摘  要

NOVELTY - Strengthening interfacial bonding force of metal and insulating substrate, (1) pretreating the surface and/or pore structure of the insulating substrate; (2) coating the prepared graphene dispersion liquid on the surface and/or pore structure of the charge-adjusted insulating substrate obtained in step (1), and drying to form a conductive layer for metal plating; and (3) graphene and electroplated metal in conductive layer forming physical interpenetrating network structure; graphene dispersion liquid comprises water, graphene, bonding auxiliary agent and water-soluble conductive polymer, the bonding auxiliary agent enhances the covalent connection between the conductive layer and the electroplated metal during the electroplating process, and at same time interacts with the pretreated insulating substrate surface and/or groups of the pore structure. Substrate comprises surface and pore structure that is sunken on surface. USE - The method is useful for strengthening interfacial bonding force of metal and insulating substrate in electroplating process, preferably for flexible circuit board, and metallization of non-metallic surfaces. ADVANTAGE - The method: used insulating substrate uses graphene as binding medium to achieve a firm connection with metal, at same time, according to change of graphene processing, conductive layer also has flexibility of micro-morphology and adjustable position.