• 专利标题:   Forming semiconductor structure involves providing a substrate, forming plasma by inductive coupling bombards a graphene target, and sputter depositing diamond-like carbon film on the substrate.
  • 专利号:   CN110965022-A
  • 发明人:   CHEN G
  • 专利权人:   CHANGXIN STORAGE TECHNOLOGY CO LTD
  • 国际专利分类:   C23C014/06, C23C014/34
  • 专利详细信息:   CN110965022-A 07 Apr 2020 C23C-014/06 202033 Pages: 9 Chinese
  • 申请详细信息:   CN110965022-A CN11139884 28 Sep 2018
  • 优先权号:   CN11139884

▎ 摘  要

NOVELTY - Forming semiconductor structure involves providing a substrate, forming plasma by inductive coupling bombards a graphene target, and sputter depositing diamond-like carbon film on the substrate. USE - Method of forming a semiconductor structure. ADVANTAGE - The method enables to form semiconductor structure that increases the proportion of sp3 hybrid carbon in the generated diamond-like carbon thin film and reduces the hydrogen content, greatly improves the selection ratio of the carbon film, and can be applied to higher resolution and smaller size.