• 专利标题:   Preparing conductive graphene/polydimethylsiloxane nano composite material useful in producing sensor comprises mixing polydimethylsiloxane with curing agent, stirring, adding graphene filling agent, and ultrasonically dispersing.
  • 专利号:   CN111849167-A
  • 发明人:   ZHANG X
  • 专利权人:   JINLING INST TECHNOLOGY
  • 国际专利分类:   B82Y030/00, B82Y040/00, C08K003/04, C08L083/04, G01B007/16
  • 专利详细信息:   CN111849167-A 30 Oct 2020 C08L-083/04 202094 Pages: 11 Chinese
  • 申请详细信息:   CN111849167-A CN10554361 17 Jun 2020
  • 优先权号:   CN10554361

▎ 摘  要

NOVELTY - Preparing conductive graphene/polydimethylsiloxane nano composite material comprises (a) mixing polydimethylsiloxane with curing agent in a mass ratio of 8-12:1, then stirring for 18-25 minutes to obtain dimethylsiloxane polymer, (b) adding graphene filling agent to the polymer, and using planetary centrifugal mixer for stirring and antifoaming for 3-5 minutes to obtain graphene-dimethylsiloxane polymer, and (c) ultrasonically dispersing the graphene-dimethylsiloxane polymer for 18-25 minutes, and antifoaming in a vacuum drying box to form a uniform fluid. USE - The conductive graphene/polydimethylsiloxane nanocomposite material is useful in producing sensor (claimed). ADVANTAGE - The material: has high conductive properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for use of conductive graphene/polydimethylsiloxane nanocomposite material in producing sensor, where the manufacturing method of sensor comprises (a) using polyethylene terephthalate as the bottom substrate, (b) spin-coating the polydimethylsiloxane on the upper surface of the lower substrate by a spin coating method, then forming a lower substrate on the upper surface of the lower substrate, and curing, (c) fixing the mold on the substrate, injecting the prepared fluid into the mold, heating at 100-120 degrees C for 15-20 minutes, demolding, forming graphene-dimethylsiloxane polymer interlayer on the lower substrate, and embedding the bottom of interlayer in the lower substrate, (d) using conductive glue for binding the copper electrode to interlayer, (e) using polyethylene terephthalate as the upper substrate, spin-coating the polydimethylsiloxane on the lower surface of the lower substrate by a spin coating method, and curing, and (e) forming upper substrate on the lower surface of the substrate, then inverting the interlayer and lower substrate on the upper substrate, and heating at 80-150 degrees C for 10-25 minutes to form sensor with an interlayer, and embedding the side of the interlayer adjacent to the upper substrate.