• 专利标题:   Polylactic acid composite biofilm carrier material comprises e.g. diatomite, polylactic acid, graphene oxide, polypropylene, chitosan, lignocellulose, trimethylhexadecyl ammonium bromide, silica sol, humic acid sodium salt and water.
  • 专利号:   CN107840442-A
  • 发明人:   ZHENG J, WANG X, LI W, CHEN X
  • 专利权人:   HENAN ZHILIAN HUANYU INTELLECTUAL PROPERTY OPERATION CO LTD
  • 国际专利分类:   C02F003/00, D01F008/14, D01F008/18, D01F008/06, D01F001/10
  • 专利详细信息:   CN107840442-A 27 Mar 2018 C02F-003/00 201828 Pages: 5 Chinese
  • 申请详细信息:   CN107840442-A CN10834429 20 Sep 2016
  • 优先权号:   CN10834429

▎ 摘  要

NOVELTY - Polylactic acid composite biofilm carrier material comprises 8-10 pts. wt. diatomite, 14-18 pts. wt. polylactic acid, 0.3-0.4 graphene oxide, 4-6 pts. wt. tapioca starch, 2-3 pts. wt. gum arabic, 40-50 pts. wt. polypropylene, 8-12 pts. wt. chitosan, 3-5 pts. wt. lignocellulose, 1-2 pts. wt. trimethylhexadecyl ammonium bromide, 0.5-1.5 pts. wt. silica sol, 0.3-0.5 pts. wt. humic acid sodium salt and 15-10 pts. wt. water. USE - Used as polylactic acid composite biofilm carrier material. ADVANTAGE - The carrier material: has light weight, large surface activation area and rich carbon source, excellent fluidity, and absorption property, corrosion resistance, and improved water purification effect. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing polylactic acid composite biofilm carrier material comprising mixing above raw materials and then feeding into twin-screw extruder for compounding, extruding composite chips at 180-220 degrees C, cooling chips, then injecting into melt-blown nonwovens, solidifying filaments to obtain composite fiber bundles with a diameter of 1-2 mm.