1. 平台首页
  2. 国际专利信息
  • 专利标题:   Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.
  • 专利号:   US2012077039-A1, JP2012072405-A, KR2012032869-A, CN102558767-A, KR1193311-B1, TW201217446-A
  • 发明人:   LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J
  • 专利权人:   SAMSUNG ELECTROMECHANICS CO, SAMSUNG ELECTROMECHANICS CO, SAMSUNG ELECTROMECHANICS CO
  • 国际专利分类:   B28B001/14, B32B019/00, B32B027/38, C08G059/40, C08J005/18, C08K003/04, C08L101/00, C08L063/00, H01B003/40, H05K001/02, H05K003/00, C08J003/20, H05K003/38
  • 专利详细信息:   US2012077039-A1 29 Mar 2012 B32B-027/38 201224 Pages: 6 English
  • 申请详细信息:   US2012077039-A1 US235040 16 Sep 2011
  • 优先权号:   KR094412

▎ 摘　　要

NOVELTY - Polymer resin composition (I) (100) comprises: polymer resins; and graphene (120) for linking the polymer resins with larger attraction (10) than Van Der Waals's force of the polymer resins. USE - (I) is useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board (claimed). ADVANTAGE - (I) has reduced expansion and contraction ratio according to variation in temperature. The insulating film reduces coefficient of thermal expansion of a build-up multi-layered circuit board. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for manufacturing an insulating film for manufacture of a printed circuit board comprising preparing a mixture by mixing polymer resins and graphene, mixing and dispersing the mixture to form (I), and casting (I) to make a film. DESCRIPTION OF DRAWING(S) - The figure shows the polymer resin composition. Attraction (10) Polymer resin composition (100) Epoxy resin (110) Graphene (120)