▎ 摘　　要

NOVELTY - A thermally conductive adhesive comprises 30-50 pts. wt. composite resin, 6-10 pts. wt. thermally conductive filler, 8-16 pts. wt. vinyl-terminated silicone oil, 1-3 pts. wt. platinum catalyst, 1-3 pts. wt. curing agent and 1-5 pts. wt. leveling agent. USE - Thermally conductive adhesive used for bonding electronic circuit baseplate for circuit board. ADVANTAGE - The adhesive has high impact strength, tensile strength, thermal conductivity, thermal stability, high temperature resistance, insulation performance, processing performance, high quality and low cost, and is prepared by a simple and convenient method suitable for industrial production using environmentally-friendly and pollution-free raw materials. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of the adhesive, which involves adding composite resin, vinyl-terminated silicone oil and thermally conductive filler into a kneader, heating at 140-160°C, stirring for 2-4 hours, vacuumizing at vacuum degree of -(0.09-0.1) MPa to obtain a mixture (A), mixing and heating vinyl organosiloxane, polyethylene oxide and graphene chloride at 40-60°C, continuously stirring for 15-25 minutes to obtain a mixture (B), adding the platinum catalyst, curing agent, leveling agent and the mixture B to the mixture (A), and stirring and reacting for 3-7 hours.