▎ 摘　　要

NOVELTY - A LED heat dissipation ceramic substrate comprises 40-50 pts. wt. aluminum nitride, 8-12 pts. wt. nano-aluminum nitride, 0.4-0.5 pt. wt. nano-graphite, 2-3 pts. wt. yttrium oxide, 0.1-0.2 pt. wt. graphene oxide, 1-2 pts. wt. polyvinyl alcohol, 10-15 pts. wt. ionic liquid, 0.1-0.2 pt. wt. potassium carbonate, 0.1-0.2 pt. wt. aluminum isopropoxide, 0.4-0.5 pt. wt. tetraethoxysilane, 20-25 pts. wt. deionized water, and dilute nitric acid solution. USE - High-power LED heat dissipation ceramic substrate (claimed). ADVANTAGE - The heat dissipation ceramic has excellent dispersibility, associativity of raw materials, excellent wettability, heat stability, reduced oxygen content during sintering process, improved aluminum nitride lattice, improved abrasion resistance, pressure resistance, heat conduction effect, excellent mechanical property, compact and smooth surface, and anti-cracking effect. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of LED heat dissipation ceramic substrate.