▎ 摘　　要

NOVELTY - The heat sink (100) has a heat dissipation plate (110) that is provided with a contact surface (111) that is in surface contact with the system on chip (SoC) (220) of a TV board (200) and is provided with a predetermined gap with the double data rate (DDR) memory of the TV board. A surface area increasing layer is formed for increasing a heat dissipation area by sand-processing a surface of the heat dissipation plate that is not in contact with the SoC. A coating layer is formed for increasing the radiant heat effect by coating the surface of the surface area increasing layer. One side of a heat dissipation unit is fixed to the heat dissipation plate in a contact state, and other side is in surface contact with the DDR memory with a predetermined elastic force. The heat dissipation unit is provided for transferring the heat generated from the DDR memory to the heat dissipation plate to dissipate heat. USE - Multi-contact type high-performance heat sink for TV board. ADVANTAGE - The heat dissipation performance is increased even when the size of the heat sink plate is reduced by forming the surface area increasing layer and the coating layer on the surface of the plate in addition to multiple direct contacts with the heat dissipating portions of the TV board. The heat sink is fixed by simple caulking operation, so that smooth mass production operation is possible. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the multi-contact type high-performance heat sink for TV board. 100Multi-contact type high-performance heat sink 110Heat dissipation plate 111Contact surface 200TV board 220SoC