• 专利标题:   Preparing tin-bismuth series lead-free brazing filler metal containing graphene and MAX phase useful in low-temperature soft soldering field, involves mixing enhanced phase powder with tin-bismuth metal powder, installing mold and cooling.
  • 专利号:   CN113001056-A
  • 发明人:   MA D, LI H, WANG J
  • 专利权人:   UNIV XINJIANG
  • 国际专利分类:   B23K035/26, B23K035/40
  • 专利详细信息:   CN113001056-A 22 Jun 2021 B23K-035/26 202156 Pages: 6 Chinese
  • 申请详细信息:   CN113001056-A CN10276543 15 Mar 2021
  • 优先权号:   CN10276543

▎ 摘  要

NOVELTY - Preparing tin-bismuth series lead-free brazing filler metal containing graphene and MAX phase comprises taking the sample powder with an electronic balance according 0-1.0 wt.% titanium-aluminum carbide and 0-0.1 wt.% graphene nano sheet, mixing enhanced phase powder with tin-bismuth metal powder, placing into ball mill to mix uniformly, pouring mixed powder sample into die-casting mold, installing mold on fixed position of hydraulic machine, keeping pressure for 10 minutes under pressure of 30 MPa, taking mold from hydraulic machine, placing in constant temperature box with set temperature, smelting for 2 hours, cooling along with furnace, and taking out cake-shaped block composite brazing filler metal from mold. USE - The method for preparing tin-bismuth series lead-free brazing filler metal is useful in low-temperature soft soldering field. ADVANTAGE - The solder alloy has eutectic structure and good wettability; the melting point is low; the microstructure is uniform; does not contain toxic and harmful element, and is an environment-friendly brazing filler metal.